Overview
The SSP 1000 is a state-of-the-art desktop RF sputtering (PVD) system, purpose-built for research and development of thin films, nanomaterials, and advanced coatings. Its innovative cubic chamber design allows for flexible installation and selectable deposition direction—upward, sideways, or downward—enabling optimal process adaptation for a wide variety of substrates, including wafers, glass, and irregular shapes. With robust automation, precise manual controls, and a high-performance magnetron cathode, the SSP 1000 delivers reproducible, high-quality films for both routine and exploratory applications.
Key Features
- Selectable deposition direction: Easily switch between sputter-up, side, or down to match substrate geometry and minimize contamination risk
- High-uniformity film thickness: Achieve <±5% uniformity across Φ100 mm with substrate rotation, ensuring consistent results for research and prototyping
- Advanced planar magnetron cathode (2-inch, with shutter): Same proven design as high-end models, supporting a wide range of target materials
- RF power supply with pulse mode: Enables stable deposition of metals, dielectrics, and insulating targets, reducing arcing and improving film quality
- Automated vacuum exhaust system: One-button operation for pump-down and venting, with integrated rotary and turbo molecular pumps for rapid cycle times
- Intuitive manual operation panel: All key process parameters (RF, pressure, flow, timer, substrate rotation, gas, shutter) are directly accessible for fine-tuning and repeatability
- Comprehensive interlock safety: Protects both user and equipment by preventing incorrect operation and ensuring safe vacuum and RF handling
- Flexible installation: Stackable or parallel arrangement, with modular cable and utility connections for easy integration into any lab setup
- Easy maintenance: Tool-free chamber access and cathode design for quick target exchange and cleaning, minimizing downtime
- Compact and lightweight: 31 kg chamber and small footprint (W608 × D608 × H766 mm) fit seamlessly into crowded research environments
Specifications
| Parameter | Specification |
|---|---|
| Chamber Dimensions | W608 × D608 × H766 mm |
| Chamber Weight | 31 kg (aluminum block construction) |
| Cathode | 2-inch planar magnetron (with shutter), compatible with a wide range of target materials |
| Film Thickness Uniformity | <±5% (Φ100 mm, with substrate rotation) |
| Deposition Directions | Up, Side, Down (by chamber placement) |
| RF Power Supply | 13.56 MHz, with pulse mode for insulating targets |
| Vacuum System | Automated rotary + turbo molecular pump, one-button operation, ultimate pressure <5×10−4 Pa |
| Base Pressure | <5×10−4 Pa |
| Process Gases | Argon (standard), optional O2, N2 |
| Substrate Size | Up to Φ100 mm (4-inch wafer), supports small and irregular substrates |
| Substrate Rotation | Standard, for improved uniformity |
| Operation | Manual panel (RF, pressure, flow, timer, rotation, gas, shutter, buzzer) |
| Safety | Comprehensive interlock for vacuum and RF systems |
| Installation | Stack or parallel, modular cable/utility connections |
| Power Supply | AC100 V, 50/60 Hz, 15 A |
| Chamber Material | Aluminum block, corrosion-resistant |
| Maintenance | Tool-free chamber and cathode access |
Typical Applications
- Deposition of metal, dielectric, and conductive thin films for electronics, optics, and energy devices
- Protective, reflective, and catalytic coatings for sensors, MEMS, and advanced materials
- Fabrication of battery electrodes, transparent conductors, and functional layers
- Thin-film research on standard, small, or irregular substrates, including glass, silicon, and ceramics
- Process development and prototyping for new materials and device architectures
Design Advantages
- Proven cathode structure ensures reliable, reproducible results across a wide range of materials
- Easy maintenance and rapid target exchange minimize downtime and maximize productivity
- Flexible chamber placement supports both process optimization and convenient maintenance
- Automated vacuum system and comprehensive safety interlocks protect users and equipment
- Compact, lightweight design fits seamlessly into any laboratory environment
- Upgradeable with optional accessories for expanded process capability
Utility Requirements
| Utility | Requirement |
|---|---|
| Power | AC100 V, 50/60 Hz, 15 A |
| Process Gas | Argon (standard), O2/N2 (optional) |
| Exhaust | Standard laboratory exhaust connection |